RT/duroid 6002 2-Layer 10mil Immersion Silver PCB for Microwave Applications
1.Introduction
Rogers RT/duroid 6002 laminates are ceramic-filled PTFE microwave materials with low dielectric constant for use in complex microwave structures. They are also low loss materials that provide excellent high frequency performance. Offering excellent mechanical and electrical properties, these materials are reliable for use in multi-layer board constructions.
2.Key Features
Low Dielectric Constant: 2.94 ±0.04
Excellent Thermal Stability: Thermal coefficient of Dk at 12 ppm/°C
Ultra-Low Loss: Dissipation factor of 0.0012 at 10GHz
High Temperature Resistance: Td 500°C TGA
Effective Thermal Management: Thermal conductivity of 0.6 W/m/k
Dimensional Stability: Low Z-axis CTE at 24 ppm/°C
Moisture Resistance: Moisture absorption of 0.02%
3.Benefits
Superior High-Frequency Performance: Low loss for excellent high frequency performance
Precision Manufacturing: Tight thickness control<
Thermal Reliability: In-plane expansion coefficient matched to copper; ideal for temperature-sensitive applications
Space-Qualified: Low out-gassing; ideal for space applications
Stable Performance: Excellent dimensional stability
Robust Construction: Excellent mechanical and electrical properties; reliable multi-layer board constructions
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RT/duroid 6002 |
| Layer Count | 2 layers |
| Board Dimensions | 68mm × 52mm = 1PC |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.25mm |
| Blind Vias | No |
| Finished Board Thickness | 0.37mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion silver |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper_layer_1 - 35 μm
Rogers RT/duroid 6002 Substrate - 10mil (0.254mm)
Copper_layer_2 - 35 μm
6.PCB Statistics:
Components: 12
Total Pads: 34
Thru Hole Pads: 16
Top SMT Pads: 18
Bottom SMT Pads: 0
Vias: 21
Nets: 2
7.Typical Applications
Phased Array Antennas
Ground Based and Airborne Radar Systems
Global Positioning System Antennas
Power Backplanes
Commercial Airline Collision Avoidance
Beam Forming Networks
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
